Structure and method to form semiconductor-on-pores (SOP) for high device performance and low manufacturing cost

ABSTRACT

A semiconducting material that has all the advantages of prior art SOI substrates including, for example, low parasitic capacitance and leakage, without having floating body effects is provided. More specifically, the present invention provides a Semiconductor-on-Pores (SOP) material that includes a top semiconductor layer and a bottom semiconductor layer, wherein the semiconductor layers are separated in at least one region by a porous semiconductor material. Semiconductor structures including the SOP material as a substrate as well as a method of fabricating the SOP material are also provided. The method includes forming a p-type region with a first semiconductor layer, converting the p-type region to a porous semiconductor material, sealing the upper surface of the porous semiconductor material by annealing, and forming a second semiconductor layer atop the porous semiconductor material.

FIELD OF THE INVENTION

The present invention relates to a semiconductor structure and a methodof fabricating the same. More particularly, the present inventionrelates to a semiconducting material that can be used as a semiconductorsubstrate in which the semiconducting material has a buried region ofporous semiconductor material beneath a device quality semiconductorlayer. The present invention also provides a method of fabricating suchas semiconducting material.

BACKGROUND OF THE INVENTION

In semiconductor processing, semiconductor-on-insulator (SOI) technologyis becoming increasingly important since it permits the formation ofhigh-speed integrated circuits (ICs). In SOI technology, a buriedinsulating layer, typically an oxide, electrically isolates a topsemiconductor layer from a bottom semiconductor layer. The topsemiconductor layer, which is often referred to as the SOI layer, isgenerally the area of the SOI substrate in which active semiconductordevice such as, for example, field effect transistors and/or bipolardevices, are built.

Devices formed using SOI technology offer many advantages over the bulksemiconductor counterparts including, for example, higher performance,absence of latch-up, higher packaging density and low voltageapplications. More specifically, devices built on SOI substrates havelower parasitic capacitance and leakage current than those that arebuilt on bulk semiconductor substrates. Lower capacitance and leakagecurrent generally provide for devices that operate at faster speeds andlower standby power.

However, SOI substrates have floating body effects and hence bodycontacts are generally needed on critical devices that cannot toleratevarying body voltage, resulting in a significant device density penalty.Also, SOI substrates are much more expensive than their bulkcounterparts because of complex processing and difficult qualitycontrol. Typically, SOI substrates are made by a layer transfer processor by an ion implantation process such as SIMOX (Separation by IonImplantation of Oxygen).

In view of the above, there is still a need to provide new and improvedsubstrate materials that have all the advantages of SOI substrates, yetovercome the floating body effects observed in prior art SOI substratewithout requiring a separate body contact.

SUMMARY OF THE INVENTION

The present invention provides a semiconducting material that can beused as a semiconductor substrate that has all the advantages of priorart SOI substrates including, for example, low parasitic capacitance andleakage, without having floating body effects. The elimination of thefloating body effects is achieved without separate body contacts thatare required in prior art SOI-containing structures.

More specifically, the present invention provides a semiconductingmaterial that can be used as a semiconductor substrate in which a thinsemiconductor layer (on the order of about 150 nm or less) is locatedatop a region that contains a porous semiconducting material. The thinsemiconductor layer is typically the area of the semiconducting material(i.e., the SOI layer) in which active semiconductor devices can beformed. Hence, in some embodiments, a portion of the thin semiconductorlayer may be used as channel region of a field effect transistor (FET).Other semiconductor devices such as, but not limited to: bipolardevices, capacitors, resistors and diodes are also contemplated in thepresent invention. Combinations of the aforementioned semiconductordevices are also contemplated.

A thin semiconducting channel region formed on a porous semiconductormaterial has a low parasitic capacitance and leakage, without havingfloating body effects, because the device body is tied to lower portionsof the inventive semiconducting material via the porous region. Thepresent invention that provides a ‘Semiconductor-On-Pores” (SOP)material.

In general terms, the SOP material of the present invention comprises:

-   a top semiconductor layer and a bottom semiconductor layer, wherein    said semiconductor layers are separated in at least one region by a    porous semiconductor material.

The term “semiconductor” is used herein to denote any material(generally single crystal) that has semiconducting properties (i.e., aconductivity between an insulator and a conductor). Examples of suchsemiconductors include, but are not limited to: Si, SiC, SiGe, SiGeC, Gealloys, GaAs, InAs, InP and other III-V compound semiconductors.Multilayers of these semiconductors as well as SOI and SiGe-on-insulatorsubstrates are also contemplated herein. Typically, the semiconductorsemployed in the present invention are Si-containing semiconductors suchas Si, SiGe, SiC, and SiGeC. Preferably, the semiconductor is Si.

In some embodiments of the present invention, a region of the poroussemiconductor separates only a portion or portions of the top and bottomsemiconductor layers. In other embodiments, the top and bottomsemiconductor layers are separated entirely by the region of poroussemiconductor, i.e., across the entire length of the SOP material.

In addition to the SOP material described above, the present inventionalso provides a semiconductor structure that comprises at least onesemiconductor device located on a surface of the SOP material. That is,the at least one semiconductor device is located on the topsemiconductor layer which is located above the region of poroussemiconductor material.

The present invention also provides a method of fabricating the SOPmaterial. The method of the present invention comprises: forming aregion of porous semiconductor material in a first semiconductor layer;annealing the first semiconductor layer containing the region of poroussemiconductor material to seal pores at an upper surface of the poroussemiconductor material; and forming a second semiconductor layer on atleast said region of porous semiconductor material containing sealedpores.

The present invention also contemplates three-dimensional structuresthat may include multiple semiconducting layers on the SOP material(formed during SOP formation or after, including by deposition or layertransfer); multiple semiconducting and conductive layers on the SOPmaterial; or multiple buried porous layers with multiple semiconducting,conductive or combinations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1F are pictorial representations (through cross sectionalviews) depicting one embodiment of the present invention in which aregion of porous semiconductor material is present along the entirelength of the SOP material.

FIGS. 2A-2D are pictorial representations (through cross sectionalviews) depicting one embodiment of the present invention in whichregions of porous semiconductor material are formed in predeterminedareas of the SOP material.

FIG. 3 is a scanning electron micrograph (SEM) showing the SOP materialof the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention, which provides a SOP material, a semiconductorstructure including the SOP material as a substrate, as well as a methodof fabricating the SOP material, will now be described in greater detailby referring to the description provided herein below as well as thedrawings that accompany the present application. It is observed that thedrawings of the present application provided in FIGS. 1-2 are providedfor illustrative purposes and, as such, they are not drawn to scale.Also, it is observed that like reference numerals are used in each ofthe drawings to denote like materials and/or elements.

As stated above, the present invention provides an SOP material, amethod of fabricating the SOP material and semiconductor structures thatinclude the SOP as a semiconductor substrate in which one or moresemiconductor devices are formed thereon. The SOP material of thepresent invention has all of the advantages of prior art SOI materials,while also overcoming the floating body effects that are typicallypresent in prior art SOI. The floating body effects are substantiallyeliminated in the SOP material of the present invention without the needof body contacts, which are required in prior art SOI materials toeliminate floating body effects. Since no separate body contacts areemployed in the present invention, the inventive SOP material does notsuffer from the device density penalty of a conventional SOI materialincluding said body contacts. It is further noted that the inventiveprocess of fabricating the SOP material is more cost efficient than thatof processing a conventional SOI material.

In general terms, the SOP material of the present invention, which willbe described in greater detail herein below, comprises a topsemiconductor layer and a bottom semiconductor layer, wherein thesemiconductor layers are separated in at least one region by a poroussemiconductor material. The process of forming the SOP material of thepresent invention, the SOP material, as well as the semiconductorstructures including the SOP material will now be described in greaterdetail.

Reference is first made to FIGS. 1A-1F which illustrate one embodimentof the present invention. In this embodiment of the present invention, aSOP material is fabricated such that a porous semiconductor material islocated throughout the entire length of the SOP material. That is, aporous semiconductor material is present such that the top and bottomsemiconductor layers are not in direct contact with each other. Thus, aSOP material containing a continuous porous semiconductor material isprovided in this embodiment of the present invention.

FIG. 1A shows an initial semiconductor layer, i.e., the firstsemiconductor layer, 10 that is used in forming the SOP material. Thefirst semiconductor layer 10 comprises any semiconducting material(generally single crystal) including, but not limited to: Si, SiC, SiGe,SiGeC, Ge alloys, GaAs, InAs, InP and other III-V compoundsemiconductors. Multilayers of these semiconductors are alsocontemplated herein as well as conventional SOI and SGOI (silicongermanium-on-insulator) substrate. In some embodiments of the presentinvention, the first semiconductor layer is derived from an isotopicallypure precursor. When SOI or SGOI substrates are used, the upper layer ofthe substrate is used as the first semiconductor layer 10 of the presentinvention. Typically, the semiconductors employed in the presentinvention are Si-containing semiconductors such as Si, SiGe, SiC, andSiGeC. Preferably, the semiconductor is Si.

The first semiconductor layer 10 may have a single crystal orientationor it may have at least two surface regions that have differentcrystallographic orientations (e.g., so-called hybrid substrates havingdifferent crystal orientations can be used in the present invention).The first semiconductor layer 10 may be unstrained, strained or containregions of strain and unstrain therein.

FIG. 1B illustrates the structure after the formation of a p-type dopantregion 14 within the first semiconductor layer 10. The term “p-typedopant” is used in the present application to describe an element fromGroup IIIA of the Periodic Table of Elements. Examples of p-type dopantsinclude, but are not limited to: Ga, Al, B, BF₂ or mixtures thereof. Inthe present application, B or BF₂ are particularly preferred.

As shown, the p-type dopant region 14 has an upper surface that is at ornear the surface of the first semiconductor layer 10. By “at or near” itis meant that the upper dopant surface is located a depth that is lessthan 200 nm from the upper surface of the first semiconductor layer 10.

The p-type doping is achieved in the present invention by ionimplantation, plasma immersion, in-situ gas phase doping or by forming asacrificial material such as, for example, a p-type doped silicate glasson the surface of the first semiconductor layer 10 and then annealingthe structure to outdiffuse the p-type dopants from the sacrificialmaterial into the first semiconductor layer. In the present invention,ion implantation is preferably used to create the p-type dopant region.

When ion implantation is used in creating the p-type dopant region, thep-type dopant ions are implanted using an energy of greater than 0.1keV, with an energy from about 0.5 to about 5 keV being more typical.The dosage of the p-type dopant being introduced by ion implantation istypically greater than 1E10 atoms/cm², with a dosage from about 1E11 toabout 5E14 atoms/cm² being more typical. Within the dosages providedabove, the p-type dopant region 14 typically has an n-type dopantconcentration of greater than 1E17 atoms/cm³, with a concentration fromabout 1E18 to about 5E19 atoms/cm³ being more typical. It is noted thatthe n-type dopant region 14 can be tuned utilizing other ionimplantation conditions. The ion implantation may occur at nominal roomtemperature (i.e., 20°-30° C.) or at a substrate temperature greaterthan 35° C. with a temperature from about 100° to about 300° C. beingmore typical.

When plasma immersion is used to introduce the p-type dopants into thefirst semiconductor layer 10, the plasma immersion is performed by firstproviding a plasma that includes the p-type dopant. The introduction ofthe p-type dopant is then performed utilizing plasma immersionconditions that are capable of forming the p-type dopant region 14 at ornear the surface of the first semiconductor layer 10. Typically, theplasma immersion is performed utilizing standard operating conditions toachieve similar ion concentrations as stated above via conventionalimplantation.

When a sacrificial material containing a p-type is used in forming thep-type dopant region 14, a sacrificial material containing the p-typedopants is first deposited on the surface of the first semiconductorlayer 10. A block mask can be formed over other regions of the structurein which the p-type dopant is not to be introduced. The sacrificialmaterial layer including the p-type dopant may comprise a boron dopedsilicate glass, for example. The p-type dopant is present in thesacrificial material in amounts that achieve similar concentrations ofthe p-type dopants in the first semiconductor layer 10 as that of theion implantation process mentioned above. The sacrificial material canbe deposited by any conventional deposition process such as, forexample, chemical vapor deposition, plasma enhanced chemical vapordeposition, evaporation, spin-on coating, and physical vapor deposition.The thickness of the sacrificial material containing the p-type dopantsmay vary.

After depositing the sacrificial material containing the p-type dopants,the material layer including the p-type dopants is then annealed underconditions that are effective for causing diffusion of the dopants fromthe material layer into the first semiconductor layer 10. The annealingmay be performed in a furnace or in a chamber in which the materiallayer was initially deposited. The anneal step is performed at atemperature of about greater than 550° C. with a temperature from about900° to about 1100° C. being more typical. In addition to the specifictypes of annealing mentioned above, the present invention alsocontemplates rapid thermal annealing, spike annealing, laser annealingand other like annealing processes that are capable of performing thesaid outdiffusion. After diffusion, the material layer is typicallystripped from the surface of the structure utilizing a conventionalstripping process.

Another technique that can be used in forming the p-type dopant regionis to introduce the p-type dopant into the first semiconductor layer 10by in-situ gas phase doping. In such a process, the doping may occurafter forming the second semiconductor layer 18 by changing theprecursors used in formation of layer 18 to include p-type dopants. Itis also possible to conduct the in-situ gas phase doping prior toforming the second semiconductor layer 18 as well.

A region of porous semiconductor material 16, such as shown in FIG. 1C,is formed utilizing an anodization technique that is performed in aHF-containing solution. The porous semiconductor material 16 formed inthe present invention may have various forms including, for example,fibrous, cyclic, linear, and random. It is noted that the poroussemiconductor material 16 is only formed in regions of the firstsemiconductor layer 10 that include the p-type dopant region 14. Theterm “HF-containing solution” denotes a mixture of HF and an electrolytesuch as hydrocarbons, alcohols, water and the like. The preferredelectrolyte employed in the present invention is concentrated HF (49 wt% HF+51 wt % H₂O). The anodization process is performed in aHF-containing bath in which the wafer is immersed and biased positively.The bath also includes an electrode that is biased negatively.

HF-anodization is a widely known and generally accepted technique offorming porous Si and other porous semiconductors, such as, for example,Ge and GaAs. By appropriate experimentation involving various HFconcentrations, current and voltage levels, doping type (p-type) anddopant concentration in the wafer and anodization time, a recipe ofanodization parameters suitable for a specific desired porous layerstructure can be found. Any known anodization apparatus can be employedin the present invention in forming the porous semiconductor material16, so long as it is designed to allow a flow of electrical current inuniform density all throughout the surface area of the firstsemiconductor layer 10.

In accordance with the present invention, the HF-anodization may becarried out utilizing the following conditions: a HF concentration, in100% electrolyte, from about 25 to about 50 wt %, with a concentrationof HF, in 100% electrolyte, from about 40 to about 50 wt % being morehighly preferred. As anodization is driven by electrical current flow,the current is normally set constant at a desired density value duringanodization. The constant current density employed during theanodization process is from about 0.1 to about 20 mA/cm², with ananodization current from about 1 to about 2 mA/cm² being more highlypreferred. Depending on the type and doping density of the firstsemiconductor layer 10, the voltage that is required to drive thecurrent densities during anodization is typically from about 0.1 toabout 10 volts, with a voltage from about 0.5 to about 5 volts beingmore highly preferred. Anodization is typically performed at about roomtemperature, for a time period from about 30 seconds to about 10minutes, with a time period from about 1 to about 5 minutes being morehighly preferred.

As stated above, the porosity of the porous semiconductor material 16can be controlled by the p-type dopant concentration, the currentdensity of anodization as well as the chemistry of the electrolyte.Typically, the porous semiconductor material 16 of the present inventionhas a porosity from about 0.01 to about 70%, with a porosity from about10 to about 40% being more highly preferred. The porous semiconductormaterial 16 is typically formed at or below the upper surface region ofthe first semiconductor layer 10. The porous semiconductor material 16is a thin layer having a thickness from about 100 nm to about 2 μm, witha thickness from about 500 nm to about 1 μm being more highly preferred.

After anodization, the structure containing the porous semiconductormaterial 16 is briefly annealed in a hydrogen ambient at elevatedtemperatures to substantially eliminate open pores on the poroussemiconductor material 16. The resulting structure including the sealedpores is shown in FIG. 1D. Note that reference numeral 18 is used todenote the surface of the sealed pores. Specifically, the hydrogenanneal is performed at a temperature from about 800° to about 1200° C.for a time period of about 10 minutes to about 2 hours. Morespecifically, the optional hydrogen anneal is performed at a temperaturefrom about 850° to about 900° C. for a time period of about 30 minutesto about 1 hour. The hydrogen anneal is normally performed utilizingpure 100% hydrogen. But, if needed, it may be admixed with an inert gassuch as He, Ar, Xe or a mixture thereof. The amount of hydrogen withinthe gas admixture is typically from about 50 to about 100%. The pressureof hydrogen used during this optional pre-annealing step is typicallyfrom about 10 to about 760 Torr.

Hydrogen annealing is known for inducing surface migration ofsemiconductor atoms that lead to the substantial elimination of opensurface pores. At elevated temperatures, however, the pores in the bulkcoalesce into larger pores to minimize the surface energy. Therefore,the hydrogen annealing process, if utilized in the present invention,should not be carried out for a long duration and with too high atemperature.

Next, and as shown in FIG. 1E, an epi-semiconductor layer 20 is formedatop the structure shown in FIG. 1D utilizing a deposition method thatis capable of growing a low-defect epi-semiconductor layer. Theepi-semiconductor layer may comprise the same or different semiconductormaterial as that of the first semiconductor layer. As shown, theepi-semiconductor layer 20 is formed on the sealed surface of the poroussemiconductor material 16. Illustrative examples of suitable depositionmethods that can be employed in the present invention include, but arenot limited to: chemical vapor deposition (CVD), plasma-assisted CVD,molecular beam epitaxial deposition, and the like. Preferably, theepi-semiconductor layer 20 is comprised of Si. The precursors used informing the epi layer can, in some embodiments, be isotopically pure.The thickness of the epi-semiconductor layer 20, which typically has amonocrystalline structure, is from of about 10 nm to about 150 nm, witha thickness of from about 25 to about 100 nm being more highlypreferred. The epi-semiconductor layer 20 can be unstrained or strainedand it will have the same crystallographic orientation as that of theporous semiconductor material 16, which has the same crystallographicorientation as that of the first semiconductor layer 10. It is notedthat the epi-semiconductor layer 20 may form the second semiconductorlayer of the inventive SOP material.

In some embodiments, the epi-semiconductor layer 20 is replaced withanother semiconductor layer (e.g., a second semiconductor layer) that istransferred to the surface of the structure shown in FIG. 1C utilizing aconventional layer transfer process. The layer transfer process mayinclude a bonding step which is performed at nominal room temperature orat elevated temperatures from about 600° to about 1100° C. The layertransfer process may also include a SMART® Cut process. The use of alayer transfer process permits the formation of a hybrid substrate inwhich the top and bottom semiconductor layers may have, in someembodiments, different crystal orientations.

As such, the structure shown in FIG. IE depicts the SOP material 50 ofthe present application. As stated above, the SOP material 50 includes atop semiconductor layer (e.g., the epi-semiconductor or secondsemiconductor layer 20) and a bottom semiconductor layer (e.g., thefirst semiconductor layer 10), wherein the semiconductor layers areseparated in at least one region by a porous semiconductor material 16.The porous semiconductor material 16 includes an interface with the topsemiconductor layer (e.g., layer 20) in which the pores are sealed,i.e., closed.

FIG. 1F shows a semiconductor structure 100 of the present inventionthat includes the SOP material 50 of the present invention as thesemiconductor substrate in which one semiconductor device is formedthereon. In the specific embodiment illustrated, the at least onesemiconductor device is a field effect transistor 54 that includes agate dielectric 56 (any insulating oxide, nitride, oxynitride ormultilayers thereof or high k dielectrics (dielectric constant greaterthan 4.0) are also contemplated herein), a gate conductor 58 (polySi,polySiGe, an elemental metal, an alloy of an elemental metal, a metalsilicide, a metal nitride, or multilayers thereof), a first set ofspacers 60 (any insulating oxide, nitride, oxynitride or multilayerthereof) and a second set of spacers 62 (the same or different, usuallydifferent, insulator as that of the first set of spacers 60),source/drain regions 64, and device channel 66. FIG. 1F also shows thepresence of isolation regions 68 which are present in the SOP material50. The isolation regions 68 can be trench isolation regions, asillustrated, or field oxide isolation regions. Trench isolation regionsare formed utilizing conventional trench isolation techniques well knownin the art, while field oxide isolation regions are formed utilizing alocal oxidation of silicon process. The depth of the isolation regions68 may extend down to and beneath the upper surface of the firstsemiconductor layer 10, as shown in FIG. 1F. Alternatively, theisolation region can be formed to a depth that extends to the sealedsurface of the porous semiconductor material 16 or the depth of theisolation region can also be located within the second semiconductorlayer 20 when the second semiconductor layer 20 is relatively thick.

The field effect transistor device shown in FIG. 1F is formed utilizingconventional CMOS processing steps that are well known in the art,including deposition of the various material layers, patterning vialithography and etching, and implantation of source/drain regions. Thevarious material layers of the field effect transistor may also beformed utilizing a replacement gate process. The structure shown in FIG.1F may also include silicide contacts, source/drain extension regions,halo implant region, stress liners, embedded stress inducing regions, aninterlevel dielectric including metal contacts to the source/drainregions as well as the gate, and other like elements that are typicallypresent in semiconductor structures including field effect transistors.

The advantages of employing the SOP material 50 as a substrate for aCMOS device include the following: (i) reduction of junction capacitanceto improve device speed; (ii) no floating body effects, hence nobody-contact is needed (denser circuits); (iii) tunable dielectricconstant by adjusting pore density of the porous semiconductor material;and (iv) a cheaper process as compared with standard SOI processing.

Reference is first made to FIGS. 2A-2D which illustrate anotherembodiment of the present invention. In this embodiment of the presentinvention, a SOP material is fabricated such that a porous semiconductormaterial is located in predetermined areas of the SOP material. That is,a porous semiconductor material is present such that the top and bottomsemiconductor layers are not in direct contact with each other in someareas, yet they may be in contact in other areas of the SOI material.Thus, a SOP material containing discrete and isolated regions of poroussemiconductor material is provided in this embodiment of the presentinvention.

FIG. 2A shows a structure after forming the p-type dopant region 14 intothe first semiconductor layer 10. This is achieved utilizing the samebasic processing as described above in FIGS. 1A-1B except that apatterned mask 12 is formed on the surface of the first semiconductorlayer 10 prior to the introduction of the p-type dopants into thatlayer. The patterned mask 12 which may comprise a photoresist and/or ahard mask material (e.g., oxide or nitride) is formed by deposition,photolithography and optionally etching. The photolithographic processincludes exposing a resist material to a pattern of radiation anddeveloping the exposed resist utilizing a conventional resist developer.Although a single patterned mask 12 is shown, the present invention alsocontemplates cases where a plurality of patterned mask is formed.Etching, which is used in cases when a hard mask material is used, maycomprise a dry etching technique (such as, reactive-ion etching, ionbeam etching, plasma etching or laser ablation) or a chemical wetetching process. As shown, the patterned mask 12 protects portions ofthe first semiconductor layer 10, while leaving other portions of thefirst semiconductor layer 10 exposed. It is at the exposed portions ofthe first semiconductor layer 10 where the p-type dopants areintroduced, thus forming p-type dopant regions 14 in selected areas ofthe first semiconductor layer 10.

Any of the three different techniques for introducing the p-type dopantsinto the first semiconductor layer 10 can be used in this embodiment ofthe present invention as well.

FIG. 2B shows the structure after removing the patterned mask 12 (via aconventional stripping process), subjecting that structure toanodization and annealing. Anodization is performed as described above,forming regions of porous semiconductor material 16 in the firstsemiconductor layer 10 in areas including the p-type dopant regions 14.Annealing, which closes the pores at the surface, is also performed asdescribed above.

FIG. 2C shows the structure after forming epi-semiconductor layer 20 onthe structure shown in FIG. 2B. The epi-semiconductor layer 20 is formedas described above in FIG. 1E. The structure shown in FIG. 2C representsthe SOP material 50 formed utilizing this embodiment. Note that the SOPmaterial 50 has discrete and isolated regions (i.e., islands) of theporous semiconductor layer 16. Note that the epitaxial growth processmentioned above may be replaced by a layer transfer process in which asecond semiconductor layer is bonded to the structure.

FIG. 2D shows a semiconductor structure 100 that includes the SOPmaterial 50 of FIG. 2C as the semiconductor substrate and at least onesemiconductor device, such as a field effect transistor, formed on thesurface of the SOP material. The advantages of using this particular SOPmaterial shown in FIG. 2C is that a higher density of pores can beformed locally to significantly reduce junction capacitance and currentleakage. Note that the porous regions are located directly beneath thesource/drain diffusion regions of the field effect transistor. Thestructure also has better body contact and heat dissipation since noisolation region is present beneath the device channel region.

FIG. 3 shows an actual SEM of the inventive SOP material 50 having acontinuous porous semiconductor material. The porous material is clearlyevident in the region between the white lines. The material above andbelow the white lines is the non-porous semiconductor layers (i.e.,layers 10 and 20).

The present invention also contemplates three-dimensional structureswhich may include multiple semiconducting layers on the SOP material(formed during SOP formation or after, including by deposition or layertransfer); multiple semiconducting and conductive layers on the SOPmaterial; or multiple buried porous semiconducting layers with multiplesemiconducting, conductive or combinations thereof. The term“semiconducting’ denotes any material that has semiconducting propertiesincluding, for example, Si, SiGe, SiGe, SiC, SiGeC, Ge alloys, InAs,InP, and other III/V or II/VI compound semiconductors. The othersemiconductor layers can be formed during formation of the SOP materialor after using deposition or layer transfer. The term “conductive” isused herein to denote materials having a conductive property including,for example, doped polySi, doped SiGe, metals, metal alloys, metalsilicides, and metal nitrides. The conductive layers would be formedusing deposition techniques well known in the art. These other layers ofthe three-dimensional structure would be located atop the secondsemiconductor layer 18. The porous semiconductor layers can be formedutilizing the technique described above.

While the present invention has been particularly shown and describedwith respect to preferred embodiments thereof, it will be understood bythose skilled in the art that the foregoing and other changes in formsand details may be made without departing from the spirit and scope ofthe present invention. It is therefore intended that the presentinvention not be limited to the exact forms and details described andillustrated, but fall within the spirit and scope of the appendedclaims.

1. A semiconductor-on-pores (SOP) material comprising: a topsemiconductor layer and a bottom semiconductor layer, wherein saidsemiconductor layers are separated in at least one region by a poroussemiconductor material, and at least one of a plurality ofsemiconducting layers atop said top semiconductor layer, a plurality ofsemiconducting and conductive layers atop said top semiconductor layer,and a plurality of buried porous semiconducting layers atop said topsemiconductor layer, wherein said plurality of buried poroussemiconductor layers further includes overlying multiple semiconductinglayers, conductive layers or a combination thereof.
 2. The SOP materialof claim 1 wherein said porous semiconductor material is continuous suchthat the top and bottom semiconductor layers are not in direct contactwith each other.
 3. The SOP material of claim 1 wherein said poroussemiconductor material is a discrete and isolated island region.
 4. TheSOP material of claim 1 wherein said semiconductor layers comprise thesame or different semiconductor selected from the group consisting ofSi, SiC, SiGe, SiGeC, Ge alloys, GaAs, InAs, InP, other III-V compoundsemiconductors and multilayers thereof.
 5. The SOP material of claim 1wherein said porous semiconductor material has an upper surface in whichthe pores are substantially closed.
 6. The SOP material of claim 1wherein said porous semiconductor material has a porosity from about0.01 to about 70%.